CISA Known Exploited Vulnerability
This vulnerability is actively exploited in the wild and listed in the CISA Known Exploited Vulnerabilities catalog.
Remediation Deadline: Dec 26, 2023
CVE-2023-33063
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.
Required Action
This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/2643808ddbedfaabbb334741873fb2857f78188a, https://git.codelinaro.org/clo/la/kernel/msm-4.14/-/commit/d43222efda5a01c9804d74a541e3c1be9b7fe110; https://nvd.nist.gov/vuln/detail/CVE-2023-33063
Vulnerability Overview
- Severity
- High
- CISA KEV
- Yes
- Ransomware
- Unknown
- Published
- Dec 5, 2023
- KEV Added
- Dec 5, 2023
- Due Date
- Dec 26, 2023
- Related Articles
- 0
Vendor
Qualcomm
Multiple Chipsets