CISA Known Exploited Vulnerability

This vulnerability is actively exploited in the wild and listed in the CISA Known Exploited Vulnerabilities catalog.

Remediation Deadline: Dec 26, 2023

CVE-2023-33063

High

EPSS 0.4%CISA KEV

Qualcomm/Multiple Chipsets

Description

Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.

EPSS — Exploit Probability

0.4%

Higher than 62.9% of all CVEs

Required Action

This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/2643808ddbedfaabbb334741873fb2857f78188a, https://git.codelinaro.org/clo/la/kernel/msm-4.14/-/commit/d43222efda5a01c9804d74a541e3c1be9b7fe110; https://nvd.nist.gov/vuln/detail/CVE-2023-33063

Risk Assessment

ELEVATED

In CISA KEV

Details

Severity: High
EPSS: 0.4%
CISA KEV: Yes
Ransomware: Unknown
Articles: 0

Timeline

Published

Dec 5, 2023

Added to KEV

Dec 5, 2023

Remediation Due

Dec 26, 2023

Affected Product

Qualcomm

Multiple Chipsets

View all Qualcomm CVEs

External Links

NVD (NIST)CVE Details MITRE CVE